所谓「电子封装 (electronic packaging) 就是在确保这些电子组件、集成电路，有一个良好的操作环境，这在汽车电子上尤其重要，因为汽车中的各项组件的操作环境通常挺糟...
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electronic numerical integrator and calculator (ENIAC) 电子数字积分器和计算器 electronic packaging 电子 封装 electronic performance support system (EPSS) 电子性能支持系统 ..
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Pentair Electronic Packaging 奔泰电子包装
high density electronic packaging 高密度电子组装 ; 高密度电子封装
electronic packaging material 电子封装材料
Electronic Packaging Technology 电子构装技术 ; 电子封装技术
electronic packaging materials 电子封装材料 ; 装材料
Introduction to Electronic Packaging 微电子封装引论
The results show that SiCp/Cu alloy electronic packaging shell with high content and uniformly distributed SiC particle can be produced at 910℃ and punching velocity of 100 mm/s, meeting the requirements of electronic packaging shell.
模拟结果表明,在半固态温度为910℃、挤压杆速度为100mm/s时,可以得到SiCp含量较高且分布较均匀的SiCp/Cu合金电子封装壳体,且能满足电子封装壳体的要求。
参考来源 - SiCThe rapid development of the high-density solder interconnection in the electronic packaging industry brings about the continiuous decrease in the size and stand-off height (SOH) of solder joints.
电子封装微互连正向高密度化方向快速发展,微焊点的尺寸及互连高度在不断降低。
参考来源 - 微小互连高度下焊点界面反应及力学性能研究·2,447,543篇论文数据，部分数据来源于NoteExpress
以上来源于: WordNet
In this paper, new progress of electronic packaging technology is presented.
本文综述了电子封装技术的最新进展。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
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